LPC1853FET256,551 NXP Semiconductors, LPC1853FET256,551 Datasheet - Page 80
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LPC1853FET256,551
Manufacturer Part Number
LPC1853FET256,551
Description
IC MCU 32BIT 512KB FLASH 256LBGA
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheets
1.LPC1830FET256551.pdf
(87 pages)
2.LPC1810FET100551.pdf
(2 pages)
3.LPC1810FET100551.pdf
(1164 pages)
Specifications of LPC1853FET256,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
NXP Semiconductors
LPC1850_30_20_10
Objective data sheet
13.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 17 February 2011
x1
and C
32-bit ARM Cortex-M3 microcontroller
LPC1850/30/20/10
x2
should be chosen smaller
x1
, C
x2
, and C
© NXP B.V. 2011. All rights reserved.
x3
in case of
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