BGA771N16 Infineon Technologies, BGA771N16 Datasheet - Page 26

• Manufacturer Part Number: BGA771N16
• Manufacturer: Infineon Technologies

Specifications of BGA771N16

• Packages: TSNP-16-1
• Frequency Hz: 900 / 1900 MHz
• Gain (typ): 16.0 dB
• F (typ): 1.1 dB
• P-1db (in): -5
• I (typ): 3.4 mA
• Lead Free Status / Rohs Status: Supplier Unconfirmed

3.2
Figure 3
Note: Package paddle (Pin 0) has to be RF grounded.
Table 14
Part Number
L1 ... L4
C1 ... C6
RREF
Data Sheet
Band III
UMTS bands III and VIII Application Circuit Schematic
Application circuit with chip outline (top view)
Parts List
RFIN
22pF
C1
Part Type
Chip inductor
Chip capacitor
Chip resistor
Band VIII
RFIN
4.3nH
22pF
C2
L1
L1
L1
3.3 pF
C3
22pF
RFINM
RFGNDM
n/c
C4
0
5
6
7
8
9
n/c
n/c
GND
8.2nH
L2
L1
Manufacturer
Various
Various
Various
10
4
RFINL
n/c
BGA771N16 - Low Power Dual-Band UMTS LNA
10nF
C5
V
EN
UMTS bands III and VIII Application Circuit Schematic
26
V
= 0 / 2 .8V
CC
11
= 2.8V
3
Biasing & Logic
VEN 2
VCC
Circuitry
V
V
GS
Size
0402
0402
0402
EN
= 0 / 2.8V
12
= 0 / 2.8V
2
Application Circuit and Block Diagram
BGA771N16_ Appl_Bands 38_ BlD.vsd
VEN1
VGS
RFOUTM
RREF
RFOUTL
n/c
n/c
16
15
14
13
1
1.5pF
1.5nH
3.3nH
C6
L3
L4
R
27k
Comment
Wirewound, Q
REF
RFOUT
Band III
RFOUT
Band VIII
V3.1, 2010-03-16
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