SC16C554DIB64,128 NXP Semiconductors, SC16C554DIB64,128 Datasheet - Page 52
![IC UART QUAD SOT314-2](/photos/6/98/69856/568-64-lqfp_sot314-2_sml.jpg)
SC16C554DIB64,128
Manufacturer Part Number
SC16C554DIB64,128
Description
IC UART QUAD SOT314-2
Manufacturer
NXP Semiconductors
Datasheet
1.SC16C554DIA68512.pdf
(55 pages)
Specifications of SC16C554DIB64,128
Number Of Channels
4, QUART
Fifo's
16 Byte
Voltage - Supply
2.5V, 3.3V, 5V
With Auto Flow Control
Yes
With Irda Encoder/decoder
Yes
With False Start Bit Detection
Yes
With Modem Control
Yes
With Cmos
Yes
Mounting Type
Surface Mount
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935270063128
SC16C554DIB64-T
SC16C554DIB64-T
SC16C554DIB64-T
SC16C554DIB64-T
Philips Semiconductors
9397 750 13132
Product data
[3]
[4]
[5]
[6]
[7]
[8]
[9]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
Rev. 05 — 10 May 2004
10 C measured in the atmosphere of the reflow
SC16C554/554D
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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