SA58637BS,118 NXP Semiconductors, SA58637BS,118 Datasheet - Page 12

• Manufacturer Part Number: SA58637BS,118
• Description: IC AMP AUDIO 2.2W STER D 20HVQFN
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of SA58637BS,118

• Output Type: 2-Channel (Stereo)
• Package / Case: 20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
• Max Output Power X Channels @ Load: 2.2W x 2 @ 8 Ohm
• Voltage - Supply: 2.2 V ~ 18 V
• Features: Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Product: Class-AB
• Output Power: 2.2 W
• Available Set Gain: 30 dB
• Thd Plus Noise: 0.15 %
• Operating Supply Voltage: 9 V
• Supply Current: 15 mA
• Maximum Power Dissipation: 2.2 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Input Bias Current (max): 500 nA
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 18 V
• Supply Voltage (min): 2.2 V
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Output Power (typ): 2.2x2@8OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.15@8Ohm@0.5W%
• Single Supply Voltage (typ): 9V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 2.2W
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 50dB
• Single Supply Voltage (min): 2.2V
• Single Supply Voltage (max): 18V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Package Type: HVQFN EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4356-2; 935285742118; SA58637BS; SA58637BS-T

NXP Semiconductors
SA58637_1
Product data sheet
14.3 Thermal behavior
The measured thermal performance of the HVQFN20 package is highly dependent on the
configuration and size of the heat spreader on the application demo board. Data may not
be comparable between different semiconductor manufacturers because the application
demo boards and test methods are not standardized. The thermal performance of a
package for a specific application may also differ from those presented here because the
configuration of the application boards copper heat spreader may be significantly different.
NXP Semiconductors uses FR-4 type application boards with 28.3 g (1 oz) copper traces
with solder coating.
The demo board (see
the IC and provides a mounting pad to solder to the die attach paddle of the HVQFN20
package. The heat spreader is symmetrical and provides a heat spreader on both top and
bottom of the PCB. The heat spreader on top and bottom side of the demo board is
connected through 2 mm diameter plated through holes. Directly under the DAP (Die
Attach Paddle), the top and bottom side of the PCB are connected by four vias. The total
top and bottom heat spreader area is 64.5 mm
The junction to ambient thermal resistance, R
when the exposed die attach paddle is soldered to a 32.3 mm
copper heat spreader on the demo PCB. The maximum sine wave power dissipation for
T
Thus, for T
The power dissipation as a function of ambient temperature curve
power derating profiles with ambient temperature for three sizes of heat spreaders. For a
more modest heat spreader using a 32.3 mm
PCB, the R
R
150 25
-------------------- -
150 60
-------------------- -
amb
th(j-a)
22
22
–
–
= 25 C is:
increases to 60 K/W.
=
=
amb
th(j-a)
5.7 W
4.1 W
= 60 C the maximum total power dissipation is:
is 31 K/W. When the package is not soldered to a heat spreader, the
Rev. 01 — 25 February 2008
Figure
16) has a 28.3 g (1 oz) copper heat spreader that runs under
2
th(j-a)
(5 in
2
(10 in
= 22 K/W for the HVQFN20 package
2
) area on the top or bottom side of the
2
).
2
2
2.2 W BTL audio amplifier
(5 in
(Figure
2
) area of 28.3 g (1 oz)
SA58637
© NXP B.V. 2008. All rights reserved.
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