TDA8933BTW/N2,118 NXP Semiconductors, TDA8933BTW/N2,118 Datasheet - Page 20

• Manufacturer Part Number: TDA8933BTW/N2,118
• Description: IC AMP AUDIO CLASS D 32HTSSOP
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TDA8933BTW/N2,118

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 20.6W x 1 @ 16 Ohm; 10.3W x 2 @ 8 Ohm
• Voltage - Supply: 10 V ~ 36 V, ±5 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935285222118

NXP Semiconductors
Table 3:
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to signal
ground (pin 7); positive currents flow into the chip. The voltage ratings are valid provided other ratings are not violated.
9. Thermal characteristics
Table 4:
10. Characteristics
Table 5:
T
to a capacitor, unless otherwise specified. All voltages are measured with respect to signal ground (pin 7); currents are
positive when flowing into the IC.
UBA2074(A)
Preliminary data sheet
Symbol
V
Latchup
Symbol
R
Symbol
High voltage
I
Start-up
V
V
V
V
V
V
Supply
I
I
V
leakage
supply(hv,start)
supply(hv,osc)
amb
ESD
VDC(start-high)
VDC(stop-high)
VDC(hys-high)
VDC(start-low)
VDC(stop-low)
VDC(hys-low)
VDD(clamp)
th(j-a)
= 25 °C; V
Limiting values
Thermal characteristics
Characteristics
VDC
Parameter
electrostatic discharge voltage
SNW-FQ-303
= 15 V; VDD not connected to VDC; V
Parameter
thermal resistance from
junction to ambient
Parameter
leakage current high voltage
pins
high-level start-up voltage
high-level stop voltage
high-level start-stop hysteresis
low-level start-up voltage
low-level stop voltage
low-level start-stop hysteresis
hig voltage configuration
start-up total supply current
into pins VDC and VDD
total supply current into pins
VDC and VDD
VDD clamp voltage
human body model
machine model
…continued
Rev. 02.0 — February 2007
Conditions
IFB, CIFB, VFB, CVFB, IREF, CT,
CF, CSWP, CPWM, SYNC,
nonFAULT, PWMa, PWMd, EN,
VDC, VDD, GLA, GLB
GHB, FSB, SHB, SHA, FSA, GHA
all pins
all pins
Conditions
in free air; SO28 package
in free air; SSOP28 package
Conditions
V
and V
V
V
V
V
V
V
V
FSA
VDC
VDC
VDC
VDC
VDC
VDC
VDC
High Voltage Full-bridge control IC for CCFL backlighting
, V
EN
=V
=V
=V
=V
=V
=V
= V
SHB
=V
FSB
VDD
VDD
VDD
VDD
VDD
VDD
VDD
= 630 V;
VDD
, V
=11V (non-oscillating)
=12V; oscillating
, I
= 0 V
VDD
GHA
; C
VDD
, V
= 5 mA
GHB
=100nF; R
, V
SHA
,
IREF
= 33 kΩ and CPWM pin connected
[2]
[1]
Min
11.5
9.6
1.8
8.6
7.7
0.9
11.5
Typ
68
108
Min
-2
-1
-250
UBA2074(A)
Typ
12
10
2
9
8
1
12.6
© NXP B.V. 2007. All rights reserved.
Max
+2
+1
+250
Max
5
12.5
10.4
2.2
9.4
8.3
1.1
0.7
3.5
13.7
Unit
K/W
K/W
Unit
kV
kV
V
Unit
µA
V
V
V
V
V
V
mA
mA
V
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