TDA8931T/N1,112 NXP Semiconductors, TDA8931T/N1,112 Datasheet
TDA8931T/N1,112
Specifications of TDA8931T/N1,112
935276045112
TDA8931T
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TDA8931T/N1,112 Summary of contents
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TDA8931 Power comparator 1 Rev. 01 — 14 January 2004 1. General description The TDA8931 is a switching power stage for high efficiency class-D audio power amplifier systems. It contains a Single-Ended (SE) power stage, drive logic, protection control logic, ...
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Philips Semiconductors Table 1: Symbol Parameter SE channel Ordering information Table 2: Type number TDA8931T 9397 750 13847 Preliminary data sheet Quick reference data …continued Conditions efficiency ...
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Philips Semiconductors 6. Block diagram POWERUP Fig 1. Block diagram 9397 750 13847 Preliminary data sheet TDA8931 5 V DDA 4 INP comparator 3 INN 2 V SSA 6 7 ENABLE 9 CGND ODP CONTROL OTP OCP 12 OVP OVP ...
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Philips Semiconductors 7. Pinning information 7.1 Pinning Fig 2. Pin configuration 7.2 Pin description Table 3: Symbol V SSD V SSA INN INP V DDA POWERUP ENABLE DIAG CGND V SSD V SSD OVP HVP STABI V SSP OUT BOOT ...
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Philips Semiconductors 8. Functional description 8.1 General The TDA8931 is a switching power stage for high efficiency class-D audio power amplifier systems. It contains a Single-Ended (SE) power stage, drive logic, protection control logic, a full differential input comparator and ...
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Philips Semiconductors Pin HVPI will be on its final level of 0.5V into a plop-noise free start-up behavior. 8.5 Half supply voltage capacitor charger (pin HVP) When the device is in Standby mode, the SE capacitor C15 (see until it ...
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Philips Semiconductors Fig 3. Overvoltage protection setting The overvoltage protection level can be determined by the formula OVP Where: V P(OVP external resistor R2 = external resistor V = 1.27 V reference voltage. OVP Example: The ...
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Philips Semiconductors 9. Internal circuitry Table 6: Pin 1, 10, 11 9397 750 13847 Preliminary data sheet Internal circuitry Symbol Equivalent circuit V SSD V SSA INN, INP V DDA POWERUP Rev. 01 — ...
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Philips Semiconductors Table 6: Pin 9397 750 13847 Preliminary data sheet Internal circuitry …continued Symbol Equivalent circuit ENABLE DIAG CGND OVP HVP STABI Rev. 01 — 14 January 2004 TDA8931 Power comparator 1 7 ...
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Philips Semiconductors Table 6: Pin 9397 750 13847 Preliminary data sheet Internal circuitry …continued Symbol Equivalent circuit V SSP OUT V DDP BOOT HVPI Rev. 01 — 14 January 2004 TDA8931 Power comparator 1 V ...
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Philips Semiconductors 10. Limiting values Table 7: In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ENABLE V OVP ORM P d(max stg T amb 11. Thermal characteristics Table ...
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Philips Semiconductors Table 9: Characteristics …continued 290 kHz; unless otherwise specified. P amb carrier Symbol Parameter Power-up input: pin POWERUP V LOW-level input voltage IL V HIGH-level input voltage IH ...
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Philips Semiconductors 13. Dynamic characteristics Table 10: Characteristics unless otherwise specified. P amb L Symbol Parameter Amplifier; SE channel P maximum output power o(max) THD total harmonic distortion ...
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Philips Semiconductors Fig 4. Timing diagram PWM output 9397 750 13847 Preliminary data sheet input V i(dif) V i(cm) t r(LH output V). ...
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R11 (1) C4 470 k 2 ( INN 47 k C11 R6 INP 2.2 k 220 nF IN POWERUP ...
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Philips Semiconductors Table 11: Item C10 C11 C12 C13 C14 C15 C16 C17 R10 R11 R12 R13 L1 U1 9397 750 13847 ...
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Philips Semiconductors 14.1 Output power estimation The output power, just before clipping, can be estimated using the following equation Where: P o(1 load impedance L R DSon R = series resistance output coil coil ...
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Philips Semiconductors 14.2 Output current limiting The output current is limited by the OCP with a threshold level of 3.3 A (minimum). During normal operation the output current should not exceed this threshold level, otherwise the output signal is distorted. ...
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Philips Semiconductors 14.4.1 Thermal layout including vias The bottom side of the double-sided PCB is used to place the SMD components including the TDA8931T and the majority of the signal tracks. The topside is used to place the leaded components. ...
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Philips Semiconductors To estimate the power dissipation, the following equation can be used Where power dissipation RMS output power ( efficiency of total application (0.91 for R The ...
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Philips Semiconductors 14.5 Measured performance figures of mono amplifier with TDA8931 Table 13 Symbol Parameter THD n(o) S/N B SVRR f c [1] Operates down to UVP ...
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Philips Semiconductors 14.6 Curves measured in typical application 2 10 THD N (%) kHz 10 100 kHz ...
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Philips Semiconductors ( ( THD = ( THD = 0 ( THD = ...
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Philips Semiconductors 100 n (%) ( ( Conditions kHz. ...
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Philips Semiconductors 16. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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Philips Semiconductors 17. Soldering 17.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 18. Revision history Table 15: Revision history Document ID Release date TDA8931_1 20050114 9397 750 13847 Preliminary data sheet Data sheet status Change notice Preliminary data sheet - Rev. 01 — 14 January 2004 TDA8931 Power comparator 1 ...
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Philips Semiconductors 19. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...