TDA8931T/N1,112 NXP Semiconductors, TDA8931T/N1,112 Datasheet - Page 31

• Manufacturer Part Number: TDA8931T/N1,112
• Description: IC AMP/COMPARATOR 22W D 20SOIC
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TDA8931T/N1,112

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 22W x 1 @ 4 Ohm
• Voltage - Supply: 12 V ~ 35 V, ±6 V ~ 17.5 V
• Features: Depop, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3609-5; 935276045112; TDA8931T

Philips Semiconductors
23. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.6.1
8.6.2
8.6.3
8.6.4
8.6.5
8.6.6
9
10
11
12
13
14
14.1
14.2
14.3
14.4
14.4.1
14.4.2
14.5
14.6
15
15.1
16
17
17.1
17.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Thermal characteristics. . . . . . . . . . . . . . . . . . 11
Static characteristics. . . . . . . . . . . . . . . . . . . . 11
Dynamic characteristics . . . . . . . . . . . . . . . . . 13
Application information. . . . . . . . . . . . . . . . . . 15
Test information . . . . . . . . . . . . . . . . . . . . . . . . 24
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 25
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Interfacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Input comparator. . . . . . . . . . . . . . . . . . . . . . . . 5
Half supply voltage input reference (pin HVPI) . 5
Half supply voltage capacitor charger (pin HVP) 6
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Overtemperature protection (OTP) . . . . . . . . . . 6
Overcurrent protection (OCP). . . . . . . . . . . . . . 6
Overvoltage protection (OVP). . . . . . . . . . . . . . 6
Undervoltage protection (UVP). . . . . . . . . . . . . 7
Supply voltage drop protection . . . . . . . . . . . . . 7
Overdissipation protection (ODP) . . . . . . . . . . . 7
Output power estimation. . . . . . . . . . . . . . . . . 17
Output current limiting. . . . . . . . . . . . . . . . . . . 18
Low pass filter considerations. . . . . . . . . . . . . 18
Thermal behavior (printed-circuit board
considerations) . . . . . . . . . . . . . . . . . . . . . . . . 18
Thermal layout including vias . . . . . . . . . . . . . 19
Thermal considerations . . . . . . . . . . . . . . . . . 19
Measured performance figures of mono amplifier
with TDA8931 . . . . . . . . . . . . . . . . . . . . . . . . . 21
Curves measured in typical application . . . . . 22
Quality information . . . . . . . . . . . . . . . . . . . . . 24
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 26
17.3
17.4
17.5
18
19
20
21
22
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Published in The Netherlands
Revision history . . . . . . . . . . . . . . . . . . . . . . . 29
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 30
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Contact information . . . . . . . . . . . . . . . . . . . . 30
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 26
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 27
Package related soldering information . . . . . . 27
Power comparator 1
Document number: 9397 750 13847
Date of release: 14 January 2004
TDA8931
20 W