M55800A Atmel Corporation, M55800A Datasheet - Page 5

• Manufacturer Part Number: M55800A
• Manufacturer: Atmel Corporation

Specifications of M55800A

• Flash (kbytes): 0 Kbytes
• Pin Count: 176
• Max. Operating Frequency: 33 MHz
• Cpu: ARM7TDMI
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 58
• Ext Interrupts: 58
• Usb Speed: No
• Usb Interface: No
• Spi: 1
• Uart: 3
• Graphic Lcd: No
• Video Decoder: No
• Camera Interface: No
• Adc Channels: 8
• Adc Resolution (bits): 10
• Adc Speed (ksps): 72
• Resistive Touch Screen: No
• Dac Channels: 1
• Dac Resolution (bits): 10
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 8
• Self Program Memory: NO
• External Bus Interface: 1
• Dram Memory: No
• Nand Interface: No
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 3.3/5.0
• Fpu: No
• Mpu / Mmu: no / no
• Timers: 6
• Output Compare Channels: 6
• Input Capture Channels: 6
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

Thermal and Reliability
Considerations
Thermal Data
Reliability Data
1727E–ATARM–01/04
In Table 5, the device lifetime is estimated with the MIL-217 standard in the “moderately
controlled” environmental model (this model is described as corresponding to an instal-
lation in a permanent rack with adequate cooling air), depending on the device Junction
Temperature. (For details see the section “Junction Temperature” on page 6.)
Note that the user must be extremely cautious with this MTBF calculation: as the MIL-
217 model is pessimistic with respect to observed values due to the way the data/mod-
els are obtained (test under severe conditions). The life test results that have been
measured are always better than the predicted ones.
Table 5. MTBF Versus Junction Temperature
Table 6 summarizes the thermal resistance data related to the package of interest.
Table 6. Thermal Resistance Data
The number of gates and the device die size are provided for the user to calculate reli-
ability data with another standard and/or in another environmental model.
Table 7. Reliability Data
Symbol
Parameter
Number of Logic Gates
Number of Memory Gates
Device Die Size
JA
JC
Junction Temperature (T
Parameter
Junction-to-ambient thermal
resistance
Junction-to-case thermal resistance
100
125
150
175
J
) (°C)
Condition
Estimated Lifetime (MTBF) (Year)
Still Air
Data
29.0
524
400
AT91M55800A
PBGA176
PBGA176
TQFP176
TQFP176
Package
25
14
8
5
K gates
K gates
20.1
Typ
9.2
21
66
mm
Unit
2
Unit
°C/
W
5