BAV99_SER NXP Semiconductors, BAV99_SER Datasheet - Page 8

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BAV99_SER

Manufacturer Part Number
BAV99_SER
Description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
11. Soldering
BAV99_SER
Product data sheet
Fig 10. Reflow soldering footprint BAV99 (SOT23/TO-236AB)
Fig 11. Wave soldering footprint BAV99 (SOT23/TO-236AB)
4.6
3
1.7
2.6
(3×)
0.7
(2×)
1.4
1.4
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 18 November 2010
(2×)
1.2
(3×)
(3×)
3.3
2.9
1.9
0.5
0.6
1
2.2
2.8
4.5
(3×)
0.6
2
preferred transport direction during soldering
High-speed switching diodes
BAV99 series
Dimensions in mm
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
solder lands
solder resist
occupied area
sot023_fr
sot023_fw
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