BAV99_SER NXP Semiconductors, BAV99_SER Datasheet - Page 9

no-image

BAV99_SER

Manufacturer Part Number
BAV99_SER
Description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
BAV99_SER
Product data sheet
Fig 12. Reflow soldering footprint BAV99S (SOT363/SC-88)
Fig 13. Wave soldering footprint BAV99S (SOT363/SC-88)
4.5
2.35
1.5
All information provided in this document is subject to legal disclaimers.
1.3
(4×)
0.6
(4×)
0.5
Rev. 8 — 18 November 2010
2.45
5.3
(4×)
(4×)
0.5
0.6
1.3
2.65
1.8
(2×)
0.6
1.5
1.5
0.4 (2×)
0.3
2.5
High-speed switching diodes
BAV99 series
Dimensions in mm
direction during soldering
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
preferred transport
sot363_fr
solder lands
solder resist
occupied area
sot363_fw
9 of 14

Related parts for BAV99_SER