JN5148 NXP Semiconductors, JN5148 Datasheet - Page 96

• Manufacturer Part Number: JN5148
• Description: The JN5148 is an ultra low power, high performance MCU combined with an IEEE802
• Manufacturer: NXP Semiconductors

B.4.2 PCB Design and Reflow Profile
PCB and land pattern designs are key to the reliability of any electronic circuit design.
The Institute for Interconnecting and Packaging Electronic Circuits (IPC) defines a number of standards for electronic
devices. One of these is the "Surface Mount Design and Land Pattern Standard" IPC-SM-782 [3], commonly referred
to as “IPC782". This specification defines the physical packaging characteristics and land patterns for a range of
surface mounted devices. IPC782 is also a useful reference document for general surface mount design techniques,
containing sections on design requirements, reliability and testability. Jennic strongly recommends that this be
referred to when designing the PCB.
The suggested reflow profile is shown in Figure 60. The specific paste manufacturers guidelines on peak flow
temperature, soak times, time above liquidus and ramp rates should also be referenced.
Figure 61: Recommended Reflow Profile for Lead-free Solder Paste or PPF lead frame
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JN-DS-JN5148-001 1v7
© NXP Laboratories UK 2011