BLM6G22-30 NXP Semiconductors, BLM6G22-30 Datasheet - Page 8

• Manufacturer Part Number: BLM6G22-30
• Description: 30 W LDMOS 2-stage power MMIC for base station applications at frequencies from 2100 MHz to 2200 MHz
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Package outline
Fig 11. Package outline SOT834-1 (HSOP16F)
BLM6G22-30_BLM6G22-30G
Product data sheet
HSOP16F: plastic, heatsink small outline package; 16 leads (flat)
Dimensions
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
mm
Unit
SOT834-1
Outline
version
(1)
max
nom
min
y
w
3.5
3.2
A
Z
2
1
16
pin 1 index
0.43
0.28
b
p
e
1.09
0.94
b
2
e
p1
IEC
(4×)
(6×)
b
5.87
5.72
b
p2
p2
D
D
1
e
0.32
0.23
1
e
c
3
(2×)
(2×)
b
16.0
15.8
p
D
JEDEC
(1)
(10×)
All information provided in this document is subject to legal disclaimers.
13.0
12.6
b
D
p1
12
1
References
(5×)
w
11
0
1.1
0.9
D
D
Rev. 4 — 7 March 2011
2
2
11.1
10.9
E
w
BLM6G22-30; BLM6G22-30G
(1)
E
JEITA
1
c
scale
6.2
5.8
E
1
5
2.9
2.5
E
2
A
1.02 1.37
W-CDMA 2100 MHz to 2200 MHz power MMIC
2
e
10 mm
e
1
5.69
e
2
H
E
E
2
E
3.81
e
detail X
3
European
projection
16.2
15.8
H
E
1.7
1.5
Q
1
0.25
v
A
© NXP B.V. 2011. All rights reserved.
Q
0.25
1
w
X
Issue date
03-10-22
10-10-20
v
0.1
sot834-1_po
y
SOT834-1
A
2.5
2.0
Z
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