STM32W108CZ STMicroelectronics, STM32W108CZ Datasheet - Page 225
STM32W108CZ
Manufacturer Part Number
STM32W108CZ
Description
High-performance, IEEE 802.15.4 wireless system-on-chip with embedded Flash memory
Manufacturer
STMicroelectronics
Datasheet
1.STM32W108CC.pdf
(232 pages)
Specifications of STM32W108CZ
Receive Current (w/ Cpu)
27 mA
Transmit Current (w/ Cpu, +3 Dbm Tx)
31 mA
Low Deep Sleep Current, With Retained Ram And Gpio
400 nA/800 nA with/without sleep timer
Standard Arm Debug Capabilities
Flash patch & breakpoint; data watchpoint & trace; instrumentation trace macrocell
Single Voltage Operation
2.1-3.6 V with internal 1.8 V and 1.25 V regulators
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STM32W108HB STM32W108CC STM32W108CB STM32W108CZ
Figure 60. UFQFPN48 7x7 mm pitch 0.5 package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
laser marking area
Z
Pin 1 indentifier
Exposed pad
solder this back-sidepad to PCB ground.
area
1
48
D
D
D2
Doc ID 16252 Rev 13
E
Y
E2
E
T
C 0.500x45°
pin1 corner
1
e
Detail Y
Detail Z
48
Package characteristics
b
ddd
R 0.125 typ.
L
A1
A0B9_ME_V3
225/232
A
Seating
plane
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