AUD10W Astec Powe, AUD10W Datasheet - Page 15

• Manufacturer Part Number: AUD10W
• Description: Ultra Low Profile Dc - Dc Module Pb-free Reflow Compatible And Rohs Compliant
• Manufacturer: Astec Powe

Reflow Soldering Information
Recommend Storage Condition
Recommend baking the module at 100degC for 24 hours if storage period is longer than 6 months.
MODEL : AUD 10W
April 05 REVISION 02
Soldering
Recommendation
III) Condition of Soldering – Recommended soldering profile (J-STD-020C):
Maximum storage period:
Storage condition:
I) Flux
II) Solder
Reflow Profile
Preheating
Peak temperature :
Maximum period above 220deg.C :
Ramp rate
Times
Solder the products with Rosin Flux (0.2wt%. chloride or less).
Do not use acid or soluble flux, because they may damage metallic parts and glass
parts and may cause defective or reduce quality.
SnAgCu solder compatible
Do not give vibration to products while solder melts under reflow process.
Please handle to wait for products cooled down enough.
Please don’t reflow a motherboard mounted the products on the lower side such as a
If need, we recommend to use supplemental mechanical contact to pins at four
corners of a substrate by other adhesive methods, for example, a thermal setting
resin rather than soldering.
below figure, because the products surely fall down from the motherboard.
SERIES
:
:
:
:
Technical Reference Note
6 months
30 deg C, 60%RH
Ultra Low Profile
AUD 10W Series
Infrared or air blow
150 – 200 deg C for 60 to 150sec
240
20 – 60sec
lower than 4 deg C / sec
Max 2 times (see below recommendation) .
5 deg C at surface.
Isolated DC-DC converter
Motherboard
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