CRF02 TOSHIBA Semiconductor CORPORATION, CRF02 Datasheet

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CRF02

Manufacturer Part Number
CRF02
Description
Toshiba Fast Recovery Diode Silicon Diffused Type
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

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Power Supply Applications
Strobo Flasher Applications
Absolute Maximum Ratings
Repetitive peak reverse voltage: V
Average forward current: I
Low forward voltage: V
Very fast reverse-recovery time: t
Suitable for compact assembly due to its small surface-mount
package, the “S−FLAT
Repetitive peak reverse voltage
Average forward current
Peak one-cycle surge forward current
(non-repetitive)
Junction temperature
Storage temperature range
Note 1: Ta = 84°C: Device mounted on a ceramic board
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Characteristics
Board size: 50 mm × 50 mm,
Soldering Land size: 2 mm × 2 mm
Board thickness: 0.64 t
Rectangular waveform (α = 180°)
TM
FM
TOSHIBA Fast Recovery Diode Silicon Diffused Type
” (Toshiba package name)
F (AV)
= 3.0 V (max.)
= 0.5 A
rr
RRM
(Ta = 25°C)
= 100 ns (max.)
Symbol
V
I
F(AV)
I
T
FSM
RRM
T
= 800 V
stg
j
CRF02
10 (50 Hz)
−40~150
−40~150
Rating
800
0.5
(Note 1)
1
Unit
°C
°C
V
A
A
Weight: 0.013 g (typ.)
JEDEC
JEITA
TOSHIBA
3-2A1A
2006-11-07
CRF02
Unit: mm

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CRF02 Summary of contents

Page 1

... CRF02 = 800 V RRM = 0 100 ns (max.) rr (Ta = 25°C) Symbol Rating Unit V 800 V RRM I 0.5 F(AV) A (Note (50 Hz) A FSM −40~150 T °C j −40~150 T °C stg 1 CRF02 Unit: mm JEDEC ― JEITA ― TOSHIBA 3-2A1A Weight: 0.013 g (typ.) 2006-11-07 ...

Page 2

... R th (j-a) (soldering land × 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size × 50 mm) (soldering land: 1.2 mm × 1.2 mm) (board thickness: 1.6 t) ⎯ (j-ℓ) Standard Soldering Pad 1.2 1.2 2 CRF02 Min Typ. Max Unit ⎯ 2.2 3.0 ⎯ ⎯ 3.0 ⎯ ⎯ 50 ⎯ ⎯ ...

Page 3

... Device mounted on a ceramic board (board size × 50 mm, land size × 2 mm, board thickness: 0. 100 0.001 0.01 3 CRF02 P – (AV) F (AV) 180° 120° α = 60° Rectangular waveform 0° α 360° Conduction angle: α ...

Page 4

... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 4 CRF02 20070701-EN 2006-11-07 ...

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