CRF02 TOSHIBA Semiconductor CORPORATION, CRF02 Datasheet - Page 2

• Manufacturer Part Number: CRF02
• Description: Toshiba Fast Recovery Diode Silicon Diffused Type
• Manufacturer: TOSHIBA Semiconductor CORPORATION

Electrical Characteristics
Marking
Handling Precaution
The absolute maximum ratings mean the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The followings are the general derating method that we recommend for designing a
circuit using this device.
VRRM: We recommend that the worst-case voltage, including surge voltage, be no greater than 80% of the absolute
IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV).
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180°. Therefore
this applies only to abnormal operation, which seldom occurs during the lifespan of the device.
For this device, we recommend a Tj of below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When
using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance
value.
Refer to the Rectifier databook for further information.
Peak forward voltage
Repetitive peak reverse current
Repetitive peak reverse current
Reverse recovery time
Thermal resistance
Thermal resistance (junction to lead)
Abbreviation Code
maximum rating of VRRM for a DC circuit; and no greater than 50% of that of VRRM for an AC circuit.
VRRM has a temperature coefficient (0.1%/℃). Be sure to take this temperature coefficient into account when
designing a device at low temperature.
Carry out sufficient heat design. If it is not possible to design a circuit with excellent heat radiation, set a margin by
using an allowable Tamax-IF (AV) curve.
F2
Characteristics
Part No.
CRF02
(Ta = 25°C)
R
I
I
Symbol
R
RRM(1)
RRM(2)
th (j-ℓ)
V
th (j-a)
t
FM
rr
I
V
V
I
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 1.2 mm × 1.2 mm)
(board thickness: 1.6 t)
FM
F
RRM
RRM
= 1 A, di/dt = −30 A/μs
= 0.5 A
Standard Soldering Pad
= 400 V
= 800 V
2
1.2
Test Condition
⎯
1.2
2.8
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Unit: mm
Typ.
2.2
⎯
⎯
⎯
⎯
⎯
⎯
⎯
2006-11-07
Max
100
140
240
3.0
3.0
50
70
20
CRF02
°C/W
°C/W
Unit
μA
μA
ns
V