NDH831N Fairchild Semiconductor, NDH831N Datasheet - Page 6

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NDH831N

Manufacturer Part Number
NDH831N
Description
N-channel Enhancement Mode Field Effect Transistor
Manufacturer
Fairchild Semiconductor
Datasheet
Typical Thermal Characteristics
Figure 13. Transconductance Variation with Drain
7
6
5
4
3
2 5
2 0
1 5
1 0
5
0
0
0
1c
1 b
Figure 15. Maximum Steady-State Drain
Current and Temperature.
V
DS
0.05
0.03
0.02
0.01
0 .5
0 .3
0 .2
0 .1
0 .0 0 0 1
= 5.0V
1
Current versus Copper Mounting Pad
Area.
0.2
2oz COPPER MOUNTING PAD AREA (in
D = 0.5
0.2
5
0.1
0.05
0.02
0.01
I
D
Single Pulse
, DRAIN CURRENT (A)
0.4
Figure 17. Transient Thermal Response Curve
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
0 .001
depending on the circuit board design.
1 0
T = -55°C
J
0.6
25°C
4.5"x5" FR-4 Board
T
Still Air
V
A
G S
1 5
= 25 C
0 .0 1
= 4.5V
125°C
2
0.8
)
o
1a
2 0
1
0 .1
t , TIME (sec)
1
2.5
1.5
0.5
Figure 14. SuperSOT
2
1
0
Figure 16. Maximum Safe Operating Area.
0.03
0.01
0
0.3
0.1
3 0
1 0
1c
3
1
1 b
0.1
Power Dissipation versus Copper
Mounting Pad Area.
R
.
0.2
SINGLE PULSE
J A
0.2
1
V
2oz COPPER MOUNTING PAD AREA (in
T
= See Note 1c
A
GS
= 25°C
= 4.5V
V
0.5
DS
, DRAIN-SOURCE VOLTAGE (V)
0.4
TM
1
P(pk)
-8 Maximum Steady-State
1 0
T - T
Duty Cycle, D = t
R
J
R
2
JA
t
1
A
JA
0.6
(t) = r(t) * R
t
= P * R
2
= See Note 1c
5
4.5"x5" FR-4 Board
T
Still Air
A
= 2 5 C
JA
1
/ t
2
0.8
JA
(t)
)
o
1 0
1 0 0
2
2 0
NDH831N Rev. D
3 0 0
1a
1
4 0

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