P6002A Teccor Electronics, Inc., P6002A Datasheet - Page 185

• Manufacturer Part Number: P6002A
• Description: solid state crowbar devices
• Manufacturer: Teccor Electronics, Inc.

© 2002 Teccor Electronics
SIDACtor
®
Data Book and Design Guide
not exceed 275 °C and the maximum temperature of the plastic body does not exceed
250 °C. (Figure 5.8)
Figure 5.7 Principle of Vapor Phase Soldering
Figure 5.8 Reflow Soldering Profile
During reflow, the surface tension of the liquid solder draws the leads of the device towards
the center of the soldering area, correcting any misalignment that may have occurred
during placement and allowing the device to set flush on the pad. If the footprints of the pad
are not concentrically aligned, the same effect can result in undesirable shifts as well.
Therefore, it is important to use a standard contact pattern which leaves sufficient room for
self-positioning.
After the solder cools, connections should be visually inspected and remnants of the flux
removed using a vapor degreaser with an azeotrope solvent or equivalent.
Vapor phase
zone
Vapor lock
(secondary
medium)
Boiling liquid (primary medium)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
<2.5
Pre-heat
30
˚
C/s
0.5 - 0.6
60
˚
5 - 23
C/s
Pre-heating Zone
( 2-4 min MAX )
90
Transport
Peak Temperature
Soaking Zone
( 2 min. MAX )
60 - 90 s typical
Time (Seconds)
120
Soak
220
1.3 - 1.6
˚
C - 245
150
˚
C/s
˚
C
180
Reflow Zone
30 - 60 s typical
( 2 min. MAX )
SIDACtor Soldering Recommendations
Reflow
Cooling pipes
Heating
elements
210
PC board
240
Cool
Down
<2.5
270
http://www.teccor.com
˚
C/s
300
[phone]