USB3250 Standard Microsystems Corporation, USB3250 Datasheet - Page 12

• Manufacturer Part Number: USB3250
• Description: Usb2.0 PHY IC
• Manufacturer: Standard Microsystems Corporation

Revision 1.5 (03-24-06)
DP
DM
RBIAS
XI/XO
VDD3.3
VDD1.8
VSS
VDDA3.3
VDDA1.8
VSSA
NAME
NAME
NAME
Note 4.1
Note 4.2
DIRECTION
DIRECTION
DIRECTION
Input
Input
N/A
N/A
N/A
N/A
N/A
N/A
I/O
I/O
A Ferrite Bead (with DC resistance <.5 Ohms) is recommended for filtering between both
the VDD3.3 and VDDA3.3 supplies and the VDD1.8 and VDDA1.8 Supplies. See
Figure 8.9 Application Diagram for 64-pin TQFP Package on page
56-pin QFN package will down-bond all VSS and VSSA to exposed pad under IC.
Exposed pad must be connected to solid GND plane on printed circuit board.
Table 4.4 Biasing and Clock Oscillator Signals
ACTIVE
ACTIVE
LEVEL
LEVEL
ACTIVE
LEVEL
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Table 4.5 Power and Ground Signals
N/A
N/A
Table 4.3 USB I/O Signals
3.3V Digital Supply. Powers digital pads. See
1.8V Digital Supply. Powers digital core.
Digital Ground. See
3.3V Analog Supply. Powers analog I/O and 3.3V analog
circuitry.
1.8V Analog Supply. Powers 1.8V analog circuitry. See
Analog Ground. See
External 1% bias resistor. Requires a 12KΩ resistor to ground.
Used for setting HS transmit current level and on-chip termination
impedance.
External crystal. 12MHz crystal connected from XI to XO.
DATASHEET
USB Positive Data Pin.
USB Negative Data Pin.
12
Note 4.2
Note 4.2
DESCRIPTION
DESCRIPTION
DESCRIPTION
SMSC GT3200, SMSC USB3250
45.
Note 4.1
USB2.0 PHY IC
Datasheet
Note 4.1