MT28C3224P20 Micron Technology, MT28C3224P20 Datasheet - Page 3

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MT28C3224P20

Manufacturer Part Number
MT28C3224P20
Description
FLASH AND SRAM COMBO MEMORY
Manufacturer
Micron Technology
Datasheet
PART NUMBERING INFORMATION
eral different combinations of features (see Figure 1).
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
MT28C3224P20_3.p65 – Rev. 3, Pub. 7/02
Micron Technology
Flash Family
28C = Dual-Supply Flash/SRAM Combo
Density/Organization/Banks
322 = 32Mb (2,048K x 16)
SRAM Density
4 = 4Mb SRAM (256K x 16)
Read Mode Operation
P = Asynchronous/Page Read
bank a = 1/4; bank b = 3/4
Micron’s low-power devices are available with sev-
PART NUMBER
MT28C3224P20FL-80 BET
MT28C3224P20FL-80 TET
MT28C3224P18FL-85 BET
MT28C3224P18FL-85 TET
MT 28C 322 4 P 20 FL-80 T ET
Valid Part Number Combinations
Part Number Chart
TIME (ns)
Figure 1
ACCESS
Table 2
80
80
85
85
256K x 16 SRAM COMBO MEMORY
3
Valid combinations of features and their correspond-
ing part numbers are listed in Table 2.
BOOT BLOCK
STARTING
ADDRESS
Bottom
Bottom
Top
Top
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2 MEG x 16 PAGE FLASH
TEMPERATURE
Boot Block Starting Address
B = Bottom boot
T = Top boot
Access Time
-80 = 80ns
-85 = 85ns
Operating Temperature Range
None = Commercial (0ºC to +70ºC)
Package Code
FL = 66-ball FBGA (8 x 8 grid)
Operating Voltage Range
20 = 1.80V–2.20V
18 = 1.70V–1.90V
-40
-40
-40
-40
OPERATING
ET = Extended (-40ºC to +85ºC)
RANGE
o
o
o
o
C to +85
C to +85
C to +85
C to +85
o
o
o
o
C
C
C
C
©2002, Micron Technology, Inc.
ADVANCE

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