ISL6208 Intersil Corporation, ISL6208 Datasheet - Page 3

• Manufacturer Part Number: ISL6208
• Description: High Voltage Synchronous Rectified Buck MOSFET Driver
• Manufacturer: Intersil Corporation

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Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V
BOOT Voltage (V
BOOT To PHASE Voltage (V
PHASE Voltage (Note 1) . . . . . . . . . . . . . . . . . . . GND - 0.3V to 30V
UGATE Voltage . . . . . . . . . . . . . . . . V
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
Ambient Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +125°C
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . .-10°C to +100°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
Electrical Specifications
V
Bias Supply Current
POR
V
V
Hysteresis
BOOTSTRAP DIODE
Forward Voltage
PWM INPUT
Input Current
PWM Three-State Rising Threshold
PWM Three-State Falling Threshold
Three-State Shutdown Hold-off Time
FCCM INPUT
FCCM LOW Threshold
FCCM HIGH Threshold
SWITCHING TIME
UGATE Rise Time (Note 5)
LGATE Rise Time (Note 5)
1. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND.
2. θ
3. θ
4. For θ
CC
CC
CC
Tech Brief TB379.
JA
JA
SUPPLY CURRENT
Rising
Falling
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
GND - 2.5V (<20ns Pulse Width, 5μJ) to VCC + 0.3V
PARAMETER
FCCM
V
BOOT-GND
PHASE
, V
PWM
- 5V (<20ns Pulse Width, 10μJ) to V
). . . . . . . . . . . . . . . . . . . . . -0.3V to 33V
BOOT-PHASE
). . . . . . . . . . . . . -0.3V to VCC + 0.3V
GND - 8V (<20ns Pulse Width, 10μJ)
3
Recommended Operating Conditions, Unless Otherwise Noted
PHASE
) . . . . . . -0.3V to 7V (DC)
- 0.3V (DC) to V
-0.3V to 9V (<10ns)
SYMBOL
t
TSSHD
I
I
PWM
VCC
t
t
V
RU
RL
F
PWM pin floating, V
V
V
V
V
V
V
V
V
BOOT
BOOT
VCC
PWM
PWM
VCC
VCC
VCC
VCC
VCC
ISL6208
= 5V, forward bias current = 2mA
= 5V
= 5V
= 5V, temperature = +25°C
= 5V, 3nF load
= 5V, 3nF load
= 5V
= 0V
TEST CONDITIONS
Thermal Information
Thermal Resistance (Typical)
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
SOIC Package (Note 2) . . . . . . . . . . . .
QFN Package (Notes 3, 4). . . . . . . . . .
(SOIC - Lead Tips Only)
FCCM
= 5V
2.40
0.50
0.70
0.50
MIN
100
3.5
-
-
-
-
-
-
-
-
-
TYP
3.40
2.90
0.55
-250
1.00
500
250
175
3.8
8.0
8.0
80
-
-
-
θ
JA
110
(°C/W)
80
MAX
3.90
0.65
1.30
250
4.1
2.0
-
-
-
-
-
-
-
-
-
March 30, 2007
θ
JC
UNITS
n/a
FN9115.2
(°C/W)
15
mV
μA
μA
μA
ns
ns
ns
V
V
V
V
V
V
V