MAC7100CVF Motorola, MAC7100CVF Datasheet - Page 7

• Manufacturer Part Number: MAC7100CVF
• Description: MAC7100 Microcontroller Family Hardware Specifications
• Manufacturer: Motorola

1
1
1
1
3.5.1
Comments:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC
MOTOROLA
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
112 LQFP, Case Outline: 987–01
144 LQFP, Case Outline: 918–03
208 MAP BGA, Case Outline: 1159A-01
100 LQFP, Case Outline: 983–02
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
surface of the board at the center lead. For fused lead packages, the adjacent lead is used.
JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Power Dissipation Simulation Details
Table 8. Thermal Resistance for 112 lead 20x20 mm LQFP, 0.65 mm Pitch
Table 7. Thermal Resistance for 100 lead 14x14 mm LQFP, 0.5 mm Pitch
Table 9. Thermal Resistance for 144 lead 20x20 mm LQFP, 0.5 mm Pitch
Table 10. Thermal Resistance for 208 lead 17x17 mm MAP, 1.0 mm Pitch
Rating
Rating
Rating
Rating
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MAC7100 Microcontroller Family Hardware Specifications
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural Convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural Convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural Convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Natural Convection
Four layer board (2s2p)
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJC
R θJC
R θJC
R θJC
R θJA
R θJB
R θJA
R θJB
R θJA
R θJB
R θJA
R θJB
Ψ JT
Ψ JT
Ψ JT
Ψ JT
Value
Value
Value
Value
Electrical Characteristics
44
34
37
29
18
42
34
35
30
22
42
34
35
30
22
46
29
38
26
19
7
2
7
2
7
2
7
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
Unit
Unit
1
1
1
1
Comments
Comments
Comments
Comments
1, 2
1, 3
1, 3
1, 3
1, 2
1, 3
1, 3
1, 3
1, 2
1, 3
1, 3
1, 3
1, 2
1, 3
1, 3
1, 3
4
5
6
4
5
6
4
5
6
4
5
6
7