RMPA2059-108 Raytheon RF Components, RMPA2059-108 Datasheet - Page 6
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RMPA2059-108
Manufacturer Part Number
RMPA2059-108
Description
Type = Wcdma ;; Circuit Description = 3V Wcdma Power Amplifier Module ;; Frequency = 1920-1980 MHZ
Manufacturer
Raytheon RF Components
Datasheet
1.RMPA2059-108.pdf
(6 pages)
RF Components
www.raytheonrf.com
Recommended
Information
Application
Solder Reflow
Profile
Specifications are based on most current or latest revision.
Revised February 6, 2003
"
attachment of the heat sink to the PWB. The solder joint should be 95% void-free and be a
consistent thickness.
"
solder with a heat gun. The device should not be subjected to more than 225°C and reflow solder in
the molten state for more than 5 seconds. No more than 2 rework operations should be performed.
RMPA2059-108
3V WCDMA Power Amplifier Module
Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free
Rework Considerations: Rework of a device attached to a board is limited to reflow of the
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
o
C/Sec
183
o
C
60
Page 6
120
150
Soak at
60 Sec
Time (Sec)
o
C for
10 Sec
180
45 Sec
183
ADVANCED INFORMATION
above
(Max)
o
C
240
Raytheon RF Components
1
o
C/Sec
Andover, MA 01810
362 Lowell Street
300