LM3S328-IQN25(T) Luminary Micro, Inc., LM3S328-IQN25(T) Datasheet - Page 353
![no-image](/images/no-image-200.jpg)
LM3S328-IQN25(T)
Manufacturer Part Number
LM3S328-IQN25(T)
Description
Microcontroller
Manufacturer
Luminary Micro, Inc.
Datasheet
1.LM3S328-IQN25T.pdf
(359 pages)
- Current page: 353 of 359
- Download datasheet (3Mb)
19
Figure 19-1. 48-Pin LQFP Package
October 8, 2006
aaa
bbb
ddd
ccc
A1
A2
D1
E1
b1
c1
A
D
E
L
b
c
Package Information
ddd
0.05
1.35
0.45
0.17
0.17
0.09
0.09
MIN
===
Tolerances of form and position
aaa
LEAD COUNT; FOOT PRINT
ccc
NOM
1.40
0.80
0.22
0.20
48, 2.0 FP
===
===
===
===
8.00 BSC
7.00 BSC
9.00 BSC
7.00 BSC
0.50 BSC
0.20
0.20
0.08
0.08
MAX
1.60
0.15
1.45
0.75
0.27
0.23
0.20
0.16
Preliminary
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. Corner radius of plastic body does not exceed 0.20.
11.
12. A1 is defined as the distance from the seating plane to the
13. Finish of leads is tin plated.
14. All specifications and dimensions are subjected to IPAC’S
15. The packages described in the drawing conform to JEDEC
All dimensions are in mm. All dimensioning and tolerancing
conform to ANSI Y14.5M-1982.
The top package body size may be smaller than the bottom
package body size by as much as 0.20.
Datums
To be determined at seating plane
Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25 per side. D1 and E1 are
maximum plastic body size dimensions including mold
mismatch.
Surface finish of the package is #24-27 Charmille
(1.6-2.3μmR
0.1μmR
Dambar removal protrusion does not exceed 0.08. Intrusion
does not exceed 0.03.
Burr does not exceed 0.08 in any direction.
Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall not cause the lead width
to exceed the maximum b dimension by more than 0.08.
Dambar cannot be located on the lower radius or the foot.
Minimum space between protrusion and adjacent lead is
0.07 for 0.40 and 0.50 pitch package.
These dimensions apply to the flat section of the lead
between 0.10 and 0.25 from the lead tip.
lowest point of the package body.
manufacturing process flow and materials.
M5-026A. Where discrepancies between the JEDEC and
IPAC documents exist, this drawing will take the
precedence.
bbb
0
A-B
.
0
and
) Pin 1 and ejector pin may be less than
-D-
to be determined at datum plane
LM3S328 Data Sheet
-C-
.
-H-
353
.
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