UPD77016 NEC, UPD77016 Datasheet - Page 51

• Manufacturer Part Number: UPD77016
• Description: 16 bits/ Fixed-point Digital Signal Processor
• Manufacturer: NEC

6. RECOMMENDED SOLDERING CONDITIONS
soldering processes are used, or if the soldering is performed under different conditions, please make sure to
consult with our sales offices.
(C10535E).
Surface mount device
PD77016GM-KMD: 160-pin plastic QFP (FINE PITCH) (24
Infrared ray reflow
VPS
Partial heating method
When soldering this product, it is highly recommended to observe the conditions as shown below. If other
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
Caution
Note Maximum allowable time from taking the soldering package out of dry pack to soldering.
Process
Storage conditions: 25 °C and relative humidity of 65 % or less.
Apply only one kind of soldering condition to a device, except for “partial heating method”,
or the device will be damaged by heat stress.
Peak temperature: 235 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 1 time,
Exposure limit
afterwards).
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 1 time,
Exposure limit
afterwards).
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (Per each side of the device).
Note
Note
: 7 days (20 hours pre-baking is required at 125 °C
: 7 days (20 hours pre-baking is required at 125 °C
Conditions
24 mm)
VP15-207-1
PD77016
IR35-207-1
Symbol
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