UPD77019-013 NEC, UPD77019-013 Datasheet - Page 54

• Manufacturer Part Number: UPD77019-013
• Description: 16 bits/ Fixed-point Digital Signal Processor
• Manufacturer: NEC

54
6. RECOMMENDED SOLDERING CONDITIONS
soldering processes are used, or if the soldering is performed under different conditions, please make sure to
consult with our sales offices.
(C10535E).
I
Vapor Phase Soldering
Partial heating method
PD77019GC-013-9EU: 100-pin plastic TQFP (FINE PITCH) (14
nfrared ray reflow
When soldering this product, it is highly recommended to observe the conditions as shown below. If other
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
Note
Caution
Process
Maximum allowable time from taking the soldering package out of dry pack to soldering.
Storage conditions: 25 °C and relative humidity of 65 % or less.
Apply only one kind of soldering condition to a device, except for “partial heating method”,
or the device will be damaged by heat stress.
Peak temperature: 235 ˚C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 ˚C or higher),
Maximum number of reflow processes : 2 times,
Exposure limit
afterwards).
Peak temperature: 215 ˚C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 ˚C or higher),
Maximum number of reflow processes : 2 times,
Exposure limit
afterwards).
Pin temperature : 300 ˚C or below,
Heat time : 3 seconds or less (Per each side of the device)
Note
Note
Preliminary Data Sheet
: 3 days (10 hours pre-baking is required at 125 ˚C
: 3 days (10 hours pre-baking is required at 125 °C
Surface Mount Device
Conditions
14mm)
IR35-103-2
VP15-103-2
PD77019-013
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