NE32584 NEC, NE32584 Datasheet - Page 10

• Manufacturer Part Number: NE32584
• Description: C to Ku BAND SUPER LOW NOISE AMPLIFIER N-CHANNEL HJ-FET
• Manufacturer: NEC

RECOMMENDED SOLDERING CONDITIONS
different conditions.
<TYPES OF SURFACE MOUNT DEVICE>
(C10535E).
[NE32584C]
10
Infrared ray reflow
Partial heating method
* Exposure limit before soldering after dry-pack package is opened.
Note Do not apply more than a single process at once, except for “Partial heating method”.
PRECAUTION Avoid high static voltage and electric fields, because this device is Hetero Junction field effect
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
Soldering process
Storage conditions: 25 °C and relative humidity at 65 % or less.
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
transistor with shottky barrier gate.
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 1, Exposure limit*: None
Flow time: 10 seconds or below,
Exposure limit*: None
Peak package’s surface temperature: 230 °C or below,
Terminal temperature: 230 °C or below,
Soldering conditions
Caution
IR30-00
Symbol
NE32584C