CHA7012 United Monolithic Semiconductors, CHA7012 Datasheet - Page 8

• Manufacturer Part Number: CHA7012
• Description: X-band HBT High Power Amplifier
• Manufacturer: United Monolithic Semiconductors

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Chip Mechanical Data and Pin references
Chip thickness = 100µm +/- 10 µm
RF pads (1, 12) = 96 x 196µm²
DC pads (2, 3, 4, 5, 9,15, 19, 20, 21, 22) = 96 x 96µm²
DC pads (7, 17) = 192 x 96µm²
DC pads (11, 13) = 288 x 96µm²
Ref. : DSCHA70127235 - 23 Aug 07
CHA7012
3, 7, 11, 13, 17, 21
6, 10, 14, 18
Pin number
5, 9, 15, 19
8, 16
2, 22
4, 20
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
12
1
Tel.: [phone] - Fax : [phone]
V,Vc1,Vc2
Pin name
GND
OUT
Vctrl
TO
IN
TI
8/10
Collector current control voltage
X-band High Power Amplifier
Power supply voltage
Ground (NC)
Description
TTL output
Output RF
TTL input
Input RF
Specifications subject to change without notice
NC