SC16IS762 Philips Semiconductors, SC16IS762 Datasheet - Page 52

• Manufacturer Part Number: SC16IS762
• Description: (SC16IS752 / SC16IS762) Dual UART
• Manufacturer: Philips Semiconductors

NXP Semiconductors
15. Package outline
Fig 37. Package outline SOT361-1 (TSSOP28)
SC16IS752_SC16IS762_6
Product data sheet
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT361-1
max.
1.1
A
28
1
Z
y
0.15
0.05
A
1
pin 1 index
0.95
0.80
A
2
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
REFERENCES
Rev. 06 — 19 December 2006
D
9.8
9.6
0
(1)
Dual UART with I
b
p
E
4.5
4.3
(2)
15
14
w
JEITA
scale
0.65
2.5
M
e
H
6.6
6.2
E
c
2
SC16IS752/SC16IS762
C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
5 mm
A
L
1
2
A
1
0.75
0.50
L
p
0.4
0.3
Q
H
E
E
detail X
PROJECTION
EUROPEAN
0.2
v
L
L
p
0.13
w
Q
A
(A )
0.1
3
© NXP B.V. 2006. All rights reserved.
y
ISSUE DATE
X
99-12-27
03-02-19
v
Z
0.8
0.5
A
M
(1)
SOT361-1
A
8
0
o
o
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