cy27ee16 Cypress Semiconductor Corporation., cy27ee16 Datasheet - Page 12

• Manufacturer Part Number: cy27ee16
• Description: 1 Pll In-system Programmable Clock Generator With Individual 16k Eeprom
• Manufacturer: Cypress Semiconductor Corporation.

Document #: 38-07440 Rev. *C
Serial Programming Interface Timing
Thermal Land Pad on PWB: Layout
Requirement for 20-lead Exposed Pad TSSOP
In order to achieve power dissipation and maintain junction
temperature within specified limits there must be an exposed
landing pad placed under the package, and the exposed pad
on the bottom of the package must be soldered to this landing
pad. This is typically achieved by placing a dense array of
Table 14.Pullable Crystal Specifications
CRYSTAL
C0/C1
ESR
T
T
Acc
Stability
o
o
SDAT
SCLK
init
Parameter
START
Load
DA6
Figure 7. Frame Format (Device Address, R/W, Register Address, Register Data)
DA5 DA0
Load Capacitance
Operating Temperature (Commercial)
Operating Temperature (Industrial)
Initial Accuracy
Temperature plus Aging Stability
+
+
R/W
START
Description
ACK
Figure 6. Start and Stop Frame
RA7
RA6 RA1
+
+
Transition
to next Bit
thermal via that connects the landing pad to the ground plane.
In order to meet the power dissipation specification of 40 °C/W,
Amkor soldered the exposed pad to a thermal land pad, and
placed thermal via on a 1.2-mm pitch (x and y) in the thermal
land pad. For more information about this package, see,
“Application Notes for Surface Mount Assembly of Amkor’s
Thermally/Electrically
Packages.” Amkor Technology, December 2001.
RA0
Min.
–40
0
ACK
STOP
D7
Typ.
±30
±80
14
D6
Enhanced
+
+
D1
SDAT
SCLK
Max.
240
35
70
85
D0
CY27EE16ZE
Leadframe
ACK
Page 12 of 17
Unit
ppm
ppm
pF
°C
°C
W
STOP
Based
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