S25FL129P Meet Spansion Inc., S25FL129P Datasheet - Page 66

• Manufacturer Part Number: S25FL129P
• Description: 128-mbit Cmos 3.0 Volt Flash Memory With 104-mhz Spi Serial Peripheral Interface Multi I/o Bus
• Manufacturer: Meet Spansion Inc.

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66
FAC024 — 24-ball Ball Grid Array (6 x 8 mm) package
PACKAGE
SYMBOL
JEDEC
SD/ SE
D x E
MD
ME
Øb
A1
A2
D1
E1
A
D
E
N
e
MIN
0.25
0.70
0.35
---
8.00 mm x 6.00 mm NOM
PACKAGE
8.00 BSC.
6.00 BSC.
5.00 BSC.
3.00 BSC.
1.00 BSC.
FAC024
0.5/0.5
NOM
N/A
0.40
---
---
---
24
6
4
J
MAX
1.20
0.90
0.45
---
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCHL
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
PACKAGE OUTLINE TYPE
D a t a
NOTE
S25FL129P
S h e e t
( P r e l i m i n a r y )
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
10 OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
DATUM C IS THE SEATING PLANE AND IS DEFINED BY THE
CROWNS OF THE SOLDER BALLS.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
S25FL129P_00_04 November 2, 2009
3642 F16-038.9 \ 09.10.09