mcf51mm256 Freescale Semiconductor, Inc, mcf51mm256 Datasheet - Page 27
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mcf51mm256
Manufacturer Part Number
mcf51mm256
Description
32-bit Coldfire V1 Central Processor Unit
Manufacturer
Freescale Semiconductor, Inc
Datasheet
1.MCF51MM256.pdf
(52 pages)
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Freescale Semiconductor
10
11
12
13
14
15
16
#
1
2
3
4
5
6
7
8
9
Resolution
Supply current low-power mode
Supply current high-power mode
Full-scale Settling time
(±0.5 LSB)
(0x080 to 0xF7F or 0xF7F to 0x080)
low-power mode
Full-scale Settling time
(±0.5 LSB)
(0x080 to 0xF7F or 0xF7F to 0x080)
high-power mode
Code-to-code Settling time
(±0.5 LSB)
(0xBF8 to 0xC08 or 0xC08 to
0xBF8)
low-power mode
Code-to-code Settling time
(±0.5 LSB)
(0xBF8 to 0xC08 or 0xC08 to
0xBF8)
high-power mode
DAC output voltage range low
(high-power mode, no load, DAC
set to 0)
DAC output voltage range high
(high-power mode, no load, DAC
set to 0x0FFF)
Integral non-linearity error
Differential non-linearity error
VDACR is > 2.4 V
Offset error
Gain error
Power supply rejection ratio
V
Temperature drift of offset voltage
(DAC set to 0x0800)
Offset aging coefficient
DD
≥ 2.4 V
Characteristic
Figure 7. Offset at Half Scale vs Temperature
Table 14. DAC 12-Bit Operating Behaviors
I
I
DDA_DACHP
DDA_DACLP
Ts
Ts
Symbol
Ts
V
Ts
V
PSRR
dacouth
DNL
dacoutl
C-C
C-C
INL
T
FS
E
E
FS
A
N
co
O
G
c
HP
LP
HP
LP
R
V
Min
120
-100
12
60
50
—
DAC
—
—
—
—
—
—
—
—
—
—
2(TBD)
(TBD)
(TBD)
(TBD)
(TBD)
(TBD)
± 0.5
± 0.5
± 10
Max
TBD
100
500
100
200
± 1
12
30
—
—
5
1
Preliminary Electrical Characteristics
µV/yr
%FS
%FS
LSB
LSB
Unit
mV
mV
mV
µA
µA
dB
bit
µs
µs
µs
µs
R
R
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
See Typical
Drift figure
that follows.
Notes
27