mcm63r836 Freescale Semiconductor, Inc, mcm63r836 Datasheet - Page 20

• Manufacturer Part Number: mcm63r836
• Description: 8m Late Write Hstl
• Manufacturer: Freescale Semiconductor, Inc

MCM63R836 MCM63R918
20
PIN A1
INDEX
5
Motorola Memory Prefix
Part Number
D3
Full Part Numbers — MCM63R836FC3.0
C
D2
M
G
U
T
R
P
N
L
K
J
H
F
E
D
C
B
A
BOTTOM VIEW
1
TOP VIEW
E3
2
3
E1
E2
E
4
MCM63R836FC3.3
MCM63R836FC3.7
MCM63R836FC4.0
5
6
Freescale Semiconductor, Inc.
7
For More Information On This Product,
4X
6X
e
B
D
MCM
16X
0.2
119X
e
Go to: www.freescale.com
ORDERING INFORMATION
D1
(Order by Full Part Number)
PACKAGE DIMENSIONS
0.15
0.3
MCM63R918FC3.0
MCM63R918FC3.3
MCM63R918FC3.7
MCM63R918FC4.0
63R836
63R918
b
M
0.35 A
7 X 17 BUMP PBGA
M
3
0.25 A
CASE 999D–01
A B C
A
FC PACKAGE
A3
A2
0.2 A
SIDE VIEW
XX
A
X
A4
MCM63R836FC3.0R
MCM63R836FC3.3R
MCM63R836FC3.7R
MCM63R836FC4.0R
A1
X
SEATING
PLANE
R = Tape and Reel, Blank = Tray
Speed (3.0= 3.0 ns, 3.3 = 3.3 ns,
Package (FC = Flipped Chip PBGA)
3.7 = 3.7 ns, 4.0 = 4.0 ns)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. ALL DIMENSIONS IN MILLIMETERS.
3. DIMENSION b IS THE MAXIMUM SOLDER BALL
4. DATUM A, THE SEATING PLANE, IS DEFINED BY
5. AN AI INDEX MARK WILL BE LOCATED IN THIS
6. D2 AND E2 DEFINE THE AREA OCCUPIED BY
7. CAPACITORS MAY NOT BE PRESENT ON ALL
8. CAUTION MUST BE TAKEN NOT TO SHORT
Y14.5M,1992.
DIAMETER MEASURED PARALLEL TO DATUM
PLANE A.
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
AREA.
THE DIE. D3 AND E3 ARE THE MINIMUM
CLEARANCE FROM THE PACKAGE EDGE TO THE
CHIP CAPACITORS.
DEVICES.
EXPOSED METAL CAPACITOR PADS ON
PACKAGE TOP.
DIM
A1
A2
A3
A4
D1
D2
D3
E1
E2
E3
A
D
E
b
e
12.10
MCM63R918FC3.0R
MCM63R918FC3.3R
MCM63R918FC3.7R
MCM63R918FC4.0R
MILLIMETERS
MIN
0.50
1.75
0.80
0.92
1.10
7.26
1.10
0.60
–––
22.00 BSC
20.32 BSC
14.00 BSC
7.62 BSC
1.27 BSC
MOTOROLA FAST SRAM
12.40
MAX
2.77
0.70
2.07
0.92
1.15
7.46
0.90