tld4012 Tripath Technology Inc., tld4012 Datasheet - Page 11

• Manufacturer Part Number: tld4012
• Description: Adsl Line Driver Using Tripath Digital Power Processing Dpp ?
• Manufacturer: Tripath Technology Inc.

A P P L I C A T I O N I N F O R M A T I O N
P o w e r D i s s i p a t i o n D e r a t i n g f o r 5 x 5 m m T Q F P w i t h E x p o s e d D i e P a d
For operating at ambient temperatures above 25qC the device power dissipation, P
based on a 150qC maximum junction temperature T
Where T
Values apply when the exposed pad is soldered to a JEDEC standard test board.
Note that P
supplies.
The TLD4012 incorporates an exposed die pad on the underside of its package. This acts as a heat sink
and should be connected to a copper plane on the printed circuit board for optimum heat dissipation. This
copper plane must be connected to VSS15.
11
Airflow
(LFPM)
0
200
500
P
JA
DISS
of the package is determined from the table, and T
DISS
= (T
T
(Copper Pad Soldered To PCB)
5x5mm
34.5
29.1
27.2
is the power dissipated on the chip, not P
JA
J
,C/W
(max) – T

A
)/T
JA
J
(max) as given by the following equation:
CONS
A
which is the power consumed from the
is the ambient temperature.
T r i p a t h T e c h n o l o g y , I n c . - T e c h n i c a l I n f o r m a t i o n
TLD4012 – JB/Rev. 2.0a/05.02
DISS,
must be de-rated