pca9632 NXP Semiconductors, pca9632 Datasheet - Page 4

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pca9632

Manufacturer Part Number
pca9632
Description
Pca9632 4-bit Fm I?c-bus Low Power Led Driver
Manufacturer
NXP Semiconductors
Datasheet

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6. Pinning information
PCA9632_1
Objective data sheet
6.1 Pinning
6.2 Pin description
Table 2.
[1]
Symbol
LED0
LED1
LED2
LED3
V
SCL
SDA
V
Fig 2. Pin configuration for TSSOP8
SS
DD
HVSON package die supply ground is connected to both the V
pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and
board-level performance, the exposed pad needs to be soldered to the board using a corresponding
thermal pad on the board, and for proper heat conduction through the board thermal vias need to be
incorporated in the PCB in the thermal pad region.
LED0
LED1
LED2
LED3
Pin description
Pin
1
2
3
4
5
6
7
8
[1]
1
2
3
4
PCA9632DP1
Type
O
O
O
O
power supply
I
I/O
power supply
Rev. 01 — 28 September 2007
002aad040
8
7
6
5
V
SDA
SCL
V
Description
LED driver 0
LED driver 1
LED driver 2
LED driver 3
supply ground
serial clock line
serial data line
supply voltage
DD
SS
Fig 3. Pin configuration for HVSON8
4-bit Fm+ I
index area
terminal 1
LED0
LED1
LED2
LED3
SS
pin and the exposed center pad. The V
2
C-bus low power LED driver
1
2
3
4
Transparent top view
PCA9632TK
PCA9632
© NXP B.V. 2007. All rights reserved.
002aad041
8
7
6
5
V
SDA
SCL
V
DD
SS
4 of 32
SS

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