pca9698 NXP Semiconductors, pca9698 Datasheet - Page 44

• Manufacturer Part Number: pca9698
• Description: 40-bit Fm+ I2c-bus Advanced I/o Port With Reset, Oe And Int
• Manufacturer: NXP Semiconductors

Philips Semiconductors
17. Abbreviations
PCA9698_2
Product data sheet
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Table 19.
Acronym
CDM
DUT
ESD
GPIO
HBM
I
LED
MM
PICMG
PLC
POR
PWM
RAID
SMBus
2
C-bus
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods .
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 C
body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Description
Charged Device Model
Device Under Test
ElectroStatic Discharge
General Purpose Input/Output
Human Body Model
Inter-Integrated Circuit bus
Light Emitting Diode
Machine Model
PCI Industrial Computer Manufacturers Group
Programmable Logic Controller
Power-On Reset
Pulse Width Modulation
Redundant Array of Independent Discs
System Management Bus
40-bit Fm+ I
Rev. 02 — 19 July 2006
10 C measured in the atmosphere of the reflow oven. The package
2
C-bus advanced I/O port with RESET, OE and INT
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
PCA9698
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