xc4025 Xilinx Corp., xc4025 Datasheet - Page 22

• Manufacturer Part Number: xc4025
• Description: Logic Cell Array Family , Inc
• Manufacturer: Xilinx Corp.

Component Availability
XC4000 Logic Cell Array Family
For a detailed description of the device architecture, see pages 2-9 through 2-31.
For a detailed description of the configuration modes and their timing, see pages 2-32 through 2-55.
For detailed lists of package pinouts, see pages 2-57 through 2-67.
For package physical dimensions and thermal data, see Section 4.
Ordering Information
Description 223 240 299 304 Scan
I/O (D2)
GND
GND
VCC
Pin
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
PINS
TYPE
CODE
XC4003
XC4005
XC4006
XC4008
XC4010
XC4010D
XC4013
XC4013D
XC4020
XC4025
PG MQ PG
V7 1 5 9 W 8 1 0 3
U7 1 6 0 X7 1 0 2
V6 1 6 2 V8
U6 1 6 3 W 7
R8 1 6 4 U8
R7 1 6 5 W 6
T7 1 6 6 X6
R6 1 6 7 X4
R5 1 6 8 U7
V5 1 6 9 W 5
V4 1 7 0 V6
U5 1 7 1 T7
-
-
-
-
-
1 5 8
1 6 1 X5
-
-
-
-10
-10
-6
-5
-4
-6
-5
-4
-6
-5
-4
-6
-5
-4
-6
-5
-4
-6
-4
-6
-5
-4
-6
-4
-6
-5
-4
-6
-5
-4
-5
-5
T9 1 0 4
T8
V7
-
C = Commercial = 0 to +85 C
B = MIL-STD-883C Class B
PLAST.
PC84 PQ100 VQ100 CB100 PG120 TQ144 PG156 PQ160 CB164 PG191 CB196 PQ208 MQ208 PG223 BG225 PQ240 MQ240 PG299 HQ304
PLCC
84
C I
C I
C I
C I
C I
C I
C I
C I
C I
C I
C I
HQ Bound
9 9
9 8
9 7
9 6
9 5
9 4
9 3
9 2
9 1
9 0
8 9
8 8
C
C
C
C
C
C
C
-
-
7 0 6
7 0 9
7 1 2
7 1 5
7 1 8
7 2 1
7 2 4
7 2 7
7 3 0
7 3 3
7 3 6
7 3 9
7 4 2
PLAST.
-
-
-
-
PQFP
C I
C I
C I
C
C
C
I/O
SGCK4 (DOUT, I/O)
PLAST. BRAZED CERAM. PLAST.
PGCK4 (I/O, A1)
VQFP
I/O (D0, DIN)
100
(RCLK-BUSY/RDY)
I/O (A0, WS)
Speed Grade
Description
Device Type
I/O (D1)
CCLK
GND
GND
VCC
TDO
I / O
I / O
I / O
I / O
I / O
I / O
Pin
Example:
CQFP
TOP
I = Industrial = -40 to +100 C
Parentheses indicates future product plans
PGA
120
C I
C
C
223
PG
U4
U3
R4
U2
R3
U1
P 3
T6
V3
T5
T4
V1
T3
-
-
-
V2
XC4025 Pinouts (continued)
TQFP
144
1 7 2
1 7 3
1 7 5
1 7 6
1 7 7
1 7 8
1 7 9
1 8 0
1 8 1
1 8 2
1 8 3
1 8 4
1 8 5
240
MQ
1 7 4
-
-
-
299
W 4
W 3
W 1
W 2
XC4010-5PG191C
PG
U6
U5
U4
R5
CERAM PLAST. BRAZED CERAM. BRAZED PLAST.
X3
T6
V4
X1
V3
T5
X2
V2
C I M B
V5
PGA
156
M B
C I
C I
C I
C
C
304
HQ
8 7
8 6
8 4
8 3
8 2
8 1
8 0
7 9
7 8
7 7
7 6
7 5
7 4
7 3
7 2
-
8 5
PQFP
160
C I
C I
C I
C I
C I
C I
C I
C I
C I
C I
C I
C I
C I
C I
C
C
C
C
C
C
C
Bound
Scan
7 4 5
7 4 8
7 5 4
7 5 7
7 6 0
7 6 3
7 6 6
7 6 9
7 5 1
-
-
-
-
2
8
5
2-68
M = Mil Temp = -55 to +125 C
CQFP
164
TOP
M B
M B
I/O (CS1, A2)
Description
I/O
Package Type
GND
Pin
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
C I M B
PGA
191
M B
(A3)
C I
C I
C
C
C
Number of Pins
CQFP
196
TOP
M B
M B
223
M 3
M 4
PG
R2
P 4
N4
P 2
R1
N2
P 1
N1
T1
T2
N3
-
-
-
-
1 8 6
1 8 9
1 9 0
1 9 1
1 9 2
1 9 3
1 9 4
1 9 5
1 9 6
1 9 7
1 9 8
1 9 9
Temperature Range
240
MQ
1 8 7
1 8 8
-
-
-
PQFP
(C I)
(C I)
(C)
C I
C I
C I
C I
C I
C I
C I
C I
C I
C I
C I
C I
C I
C I
C
C
C
C
C
C
C
208
299
R4
P 5
N5
PG
T4
U2
T3
U1
P 4
R3
T2
R2
T1
N4
P 3
P 2
U3
V1
METAL CERAM. PLAST.
PQFP
C I
C I
C I
C I
C I
C I
C
C
C
304
HQ
7 1
6 8
6 7
6 6
6 5
6 4
6 3
6 2
6 1
6 0
5 9
5 8
5 7
5 6
5 5
7 0
6 9
C I (M B)
Bound
PGA
223
(C I)
(C I)
Scan
C I
(C)
C I
C I
C
1 1
2 0
2 3
2 6
2 9
3 2
3 5
3 8
4 1
4 4
4 7
5 0
5 3
5 6
1 4
-
1 7
BGA
225
Description
C I
C I
C I
C I
C I
C I
C I
C I
C
C
C
C
I/O (A4)
I/O
I/O (A6)
I/O (A7)
VCC
GND
GND
Pin
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
I / O
(A5)
PLAST.
PQFP
(C I)
(C I)
C I
C I
C I
C I
(C)
C
C
240
223
M 2
PG
K 1
K 2
K 4
L 4
L 3
L 2
L 1
M 3
K 3
-
-
-
-
-
METAL CERAM. CERAM.
-
PQFP
C I
C I
C I
C I
C
2 0 0
2 0 1
2 0 2
2 0 4
2 0 5
2 0 6
2 0 7
2 0 8
2 0 9
2 1 1
240
MQ
2 0 3
2 1 0
-
-
-
-
299
PGA
(C I)
(C I)
C I
C I
(C)
299
R1
M 4
M 2
M 1
PG
N3
P 1
N2
N1
L 5
L 4
L 3
L 1
M 3
M 5
-
L 2
304
HQ
5 4
5 2
5 0
4 9
4 8
4 7
4 5
4 4
4 3
4 2
4 1
3 9
4 0
4 6
5 1
-
304
PGA
C
C
Bound
Scan
5 9
6 5
6 8
7 1
7 4
8 0
8 3
8 6
8 9
9 2
7 7
9 5
-
6 2
-
-