xc2vp2 Xilinx Corp., xc2vp2 Datasheet
xc2vp2
Manufacturer Part Number
xc2vp2
Description
Virtex-ii Pro And Virtex-ii Pro X Platform Fpgas
Manufacturer
Xilinx Corp.
Datasheet
1.XC2VP2.pdf
(430 pages)
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DS083 (v4.7) November 5, 2007
Module 1:
Introduction and Overview
10 pages
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Module 2:
Functional Description
60 pages
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IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision
History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume.
© 2002–2007 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. PowerPC is
a trademark of IBM Corp. and is used under license. All other trademarks are the property of their respective owners.
DS083 (v4.7) November 5, 2007
Product Specification
Summary of Features
General Description
Architecture
IP Core and Reference Support
Device/Package Combinations and Maximum I/O
Ordering Information
Functional Description: RocketIO™ X Multi-Gigabit
Transceiver
Functional Description: RocketIO Multi-Gigabit
Transceiver
Functional Description: Processor Block
Functional Description: PowerPC™ 405 Core
Functional Description: FPGA
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Routing
Configuration
Input/Output Blocks (IOBs)
Digitally Controlled Impedance (DCI)
On-Chip Differential Termination
Configurable Logic Blocks (CLBs)
3-State Buffers
CLB/Slice Configurations
18-Kb Block SelectRAM™ Resources
18-Bit x 18-Bit Multipliers
Global Clock Multiplexer Buffers
Digital Clock Manager (DCM)
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Virtex-II Pro and Virtex-II Pro X Platform FPGAs:
www.xilinx.com
Module 3:
DC and Switching Characteristics
57 pages
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Module 4:
Pinout Information
302 pages
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Electrical Characteristics
Performance Characteristics
Switching Characteristics
Pin-to-Pin Output Parameter Guidelines
Pin-to-Pin Input Parameter Guidelines
DCM Timing Parameters
Source-Synchronous Switching Characteristics
Pin Definitions
Pinout Tables
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FG256/FGG256 Wire-Bond Fine-Pitch BGA Package
FG456/FGG456 Wire-Bond Fine-Pitch BGA Package
FG676/FGG676 Wire-Bond Fine-Pitch BGA Package
FF672 Flip-Chip Fine-Pitch BGA Package
FF896 Flip-Chip Fine-Pitch BGA Package
FF1148 Flip-Chip Fine-Pitch BGA Package
FF1152 Flip-Chip Fine-Pitch BGA Package
FF1517 Flip-Chip Fine-Pitch BGA Package
FF1696 Flip-Chip Fine-Pitch BGA Package
FF1704 Flip-Chip Fine-Pitch BGA Package
Complete Data Sheet
Product Specification
1
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