cy8c20436an-24lqxit Cypress Semiconductor Corporation., cy8c20436an-24lqxit Datasheet - Page 32

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cy8c20436an-24lqxit

Manufacturer Part Number
cy8c20436an-24lqxit
Description
Capsense Applications
Manufacturer
Cypress Semiconductor Corporation.
Datasheet
Packaging Information
This section illustrates the packaging specifications for the CY8C20x36A/46A/66A/96A PSoC device, along with the thermal imped-
ances for each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
Document Number: 001-54459 Rev. *D
0.20 DIA TYP.
TOP VIEW
1
2
PART NO.
LG16A
LD16A
2.9
3.1
Figure 20. 16-pin QFN No E-pad 3x3x0.6 mm Package Outline (Sawn)
DESCRIPTION
LEAD-FREE
STANDARD
2.9
3.1
0.60 MAX
SIDE VIEW
0.152 REF.
SEATING PLANE
0.05 MAX
0.20 min
1.5 (NOM)
NOTES:
1. JEDEC # MO-220
2. Package Weight: 0.014g
3. DIMENSIONS IN MM, MIN
CY8C20X36A/46A/66A/96A
0.30
0.18
BOTTOM VIEW
1.5
0.50
MAX
1
2
001-09116 *E
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0.55
0.45
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