cy8c20436an-24lqxit Cypress Semiconductor Corporation., cy8c20436an-24lqxit Datasheet - Page 37

• Manufacturer Part Number: cy8c20436an-24lqxit
• Description: Capsense Applications
• Manufacturer: Cypress Semiconductor Corporation.

Thermal Impedances
Table 34. Thermal Impedances per Package
1. T
2. To achieve the thermal impedance specified for the QFN package, the center thermal pad
Capacitance on Crystal Pins
Table 35. Typical Package Capacitance on Crystal Pins
Solder Reflow Peak Temperature
This table lists the minimum solder reflow peak temperature to achieve good solderability.
Table 36. Solder Reflow Peak Temperature
1. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
Document Number: 001-54459 Rev. *D
must be soldered to the PCB ground plane.
with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
J
= T
A
30 Ball WLCSP
+ Power x 
24 Pin QFN
30 Ball WLCSP
32 Pin QFN
48 Pin QFN
48 Pin SSOP
48 Pin SSOP
16 Pin QFN
32 Pin QFN
48 Pin QFN
16 Pin QFN
24 Pin QFN
32 Pin QFN
48 Pin QFN
Package
Package
Package
JA
.
[2]
[2]
[2]
Minimum Peak Temperature
Package Capacitance
Typical 
33 C/W
21 C/W
20 C/W
69 C/W
18 C/W
54 C/W
3.2 pF
3.3 pF
240 C
240 C
240 C
220 C
240 C
240 C
JA
[1]
[1]
Maximum Peak Temperature
CY8C20X36A/46A/66A/96A
260 C
260 C
260 C
260 C
260 C
260 C
o
C with Sn-Pb or 245 ± 5
o
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