mm908e626 Freescale Semiconductor, Inc, mm908e626 Datasheet - Page 5

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mm908e626

Manufacturer Part Number
mm908e626
Description
Integrated Stepper Motor Driver With Embedded Mcu And Lin Serial Communication
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Analog Integrated Circuit Device Data
Freescale Semiconductor
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent damage
to the device.
ELECTRICAL RATINGS
THERMAL RATINGS
Notes
Supply Voltage
Input Terminal Voltage
Maximum Microcontroller Current per Terminal
Maximum Microcontroller V
Maximum Microcontroller V
LIN Supply Voltage
ESD Voltage
Storage Temperature
Operating Case Temperature
Operating Junction Temperature
Peak Package Reflow Temperature During Solder Mounting
1.
2.
3.
4.
5.
6.
7.
Analog Chip Supply Voltage under Normal Operation (Steady-
State)
Analog Chip Supply Voltage under Transient Conditions
Microcontroller Chip Supply Voltage
Analog Chip
Microcontroller Chip
All Terminals Except VDD, VSS, PTA0 : PTA6, PTC0 : PTC1
Terminals PTA0 : PTA6, PTC0 : PTC1
Normal Operation (Steady-State)
Transient Conditions
Human Body Model
Machine Model
Charge Device Model
Transient capability for pulses with a time of t < 0.5 sec.
ESD1 testing is performed in accordance with the Human Body Model (C
ESD2 testing is performed in accordance with the Machine Model (C
ESD3 testing is performed in accordance with Charge Device Model, robotic (C
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions
Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
(3)
(2)
(1)
(4)
SS
DD
(5)
Rating
Output Current
Input Current
(6)
MAXIMUM RATINGS
(1)
(7)
V
V
BUS(DYNAMIC)
ZAP
IN
V
V
V
V
T
Symbol
SUP(
SUP(
IN
I
I
I
BUS(SS)
V
V
V
SOLDER
I
(ANALOG)
T
PIN
PIN
MVDD
MVSS
V
ESD1
ESD2
ESD3
STG
T
T
(MCU)
= 200 pF, R
DD
ZAP
C
J
(1)
(2)
SS
PK
= 100 pF, R
)
)
ZAP
= 4.0 pF).
ZAP
= 0 Ω).
ZAP
V
= 1500 Ω).
SS
- 0.3 to V
- 0.3 to 6.0
- 0.3 to 5.5
- 40 to 150
- 40 to 115
- 40 to 135
- 0.3 to 28
- 0.3 to 40
-18 to 28
± 3000
Value
± 150
± 500
±15
± 25
100
100
245
40
DD
+ 0.3
MAXIMUM RATINGS
Unit
mA
mA
mA
908E626
°C
°C
°C
°C
V
V
V
V
5

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