mpc8270vr Freescale Semiconductor, Inc, mpc8270vr Datasheet - Page 58

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mpc8270vr

Manufacturer Part Number
mpc8270vr
Description
Mpc8275 Powerquicc Ii Integrated Communications Processor
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Pinout
Figure 16
58
Not to Scale
Plated substrate via
shows the side profile of the PBGA package to indicate the direction of the top surface view.
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1 mm pitch
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Transfer molding compound
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MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Figure 15. Pinout of the 516 PBGA Package (View from Top)
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Figure 16. Side View of the PBGA Package Remove
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attach
Die
DIE
Ball bond
Wire bonds
Screen-printed
solder mask
Cu substrate traces
BT resin glass epoxy
Freescale Semiconductor
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