mpc8270vr Freescale Semiconductor, Inc, mpc8270vr Datasheet - Page 59

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mpc8270vr

Manufacturer Part Number
mpc8270vr
Description
Mpc8275 Powerquicc Ii Integrated Communications Processor
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Table 23
Table
Freescale Semiconductor
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
23.
shows the pinout list of the MPC8275 and MPC8270.
MPC8275/MPC8270
In the VR package, sphere composition is lead-free (refer to
higher temperature reflow than what is required for other PowerQUICC II
packages. Users should consult “Freescale PowerQUICC II™ Pb-Free Packaging
Information” (MPC8250PBFREEPKG) available at www.freescale.com.
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
NOTE: Temperature Reflow for the VR Package
Pin Name
MPC8275 only
Table 22
defines conventions and acronyms used in
Table
2). This requires
Ball
C16
F11
E11
D2
C1
D1
D5
C4
D7
D8
C6
C7
C8
D9
C9
E8
B4
A4
B5
B6
A6
B7
B8
A7
B9
A8
Pinout
59

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