mpc8270vr Freescale Semiconductor, Inc, mpc8270vr Datasheet - Page 74

• Manufacturer Part Number: mpc8270vr
• Description: Mpc8275 Powerquicc Ii Integrated Communications Processor
• Manufacturer: Freescale Semiconductor, Inc

Package Description
9.2 Mechanical Dimensions
Figure 17
package. Refer to
74
provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA (ZU/VV)
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA
Table
2.
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Notes:
1. Dimensions and Tolerancing per ASME
Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter, parallel to
primary data A.
4. Primary data A and the seating plane are
defined by the spherical crowns of the
solder balls.
Freescale Semiconductor
A
A1
A2
A3
b
D
D1
e
E
E1
Dim
1.45
0.60
0.85
0.25
0.65
37.50 BSC
35.56 REF
1.27 BSC
37.50 BSC
35.56 REF
Millimeters
Min
1.65
0.70
0.95
—
0.85
Max