tspc603r ATMEL Corporation, tspc603r Datasheet - Page 49

• Manufacturer Part Number: tspc603r
• Description: Powerpc 603e Risc Microprocessor Family Pid7t-603e
• Manufacturer: ATMEL Corporation

15.2
15.2.1
Figure 15-2. Mechanical Dimensions and Bottom Surface Nomenclature of the CBGA Package
5410B–HIREL–09/05
CBGA Package Parameters
2X
Mechanical Dimensions of the CBGA Package
A1 CORNER
0.200
- F -
G
B
K
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
The package parameters are as provided in the following list. The package type is 21 mm,
255-lead Ceramic Ball Grid Array (CBGA).
Figure 15-2
package.
Package outline
Interconnects
Pitch
Maximum module height
255X
0.300
0.150
A
N
provides the mechanical dimensions and bottom surface nomenclature of the CBGA
D
S
S
T
T
K
E
S
F
S
M
R
P
N
K
H
G
E
D
C
B
A
2X
T
L
J
F
P
0.200
- E -
255
1.27 mm
21 mm × 21 mm
3 mm
0.150 T
C
- T -
H
Notes: 1. Dimensioning and tolerancing per
DIM
A
B
C
D
G
H
K
N
P
2. controlling dimension: millimeter
ASME Y14.5M - 1994
2.450
0.820
0.790
5.000
5.000
MILLIMETERS
MIN
21.000 BSC
21.000 BSC
1.270 BSC
0.635 BSC
16.000
16.000
3.000
0.930
0.990
MAX
TSPC603R
0.097
0.032
0.031
0.197
0.197
MIN
0.827 BSC
0.827 BSC
0.050 BSC
0.025 BSC
INCHES
0.118
0.036
0.039
0.630
0.630
MAX
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