lu82562ex Intel Corporation, lu82562ex Datasheet - Page 35

• Manufacturer Part Number: lu82562ex
• Description: Dual Footprint
• Manufacturer: Intel Corporation

Figure 8. Ideal Ground Split Implementation
Figure 8
magnetics module/RJ-45 connector. The capacitor stuffing options (C1 – C6) are used to reduce/
filter high frequency emissions. The value(s) of the capacitor stuffing options may be different for
each board. Experiments will need to be performed to determine which value(s) provide best EMI
performance.
The table below gives some starting values for these capacitors.
The placement of C1 – C6 may also be different for each board design (i.e., not all of the capacitors
may need to be populated). Also, the capacitors may not be needed on both sides of the magnetic
module.
C3, C4
C1, C2, C5, C6
Board Edge
below shows the preferred method for implementing a ground split under an integrated
C1
Capacitors
Capacitor
Stuffing
Options
C2
C3
82562EZ(EX)/82547GI(EI) Dual Footprint Design Guide
connected to
RJ Shield
Chassis
RJ/Mag.
GND
4.7µF or 10 µF
470 pF to 0.1 µF
Terminations
Resistive
C4
Capacitor
Stuffing
Options
Value
C5
Chassis
Digital
GND
GND
C6
27