hsdl-2100 ETC-unknow, hsdl-2100 Datasheet - Page 15

• Manufacturer Part Number: hsdl-2100
• Description: Compliant Transceiver
• Manufacturer: ETC-unknow

Figure 4.0. Solder Paste Stencil/Aperture.
3.0. Pick and Place
Misalignment Tolerance
and Product Self-Alignment
after Solder Reflow
2.0. Recommended Solder
Paste/Cream Volume for
Castellation Joints.
The printed solder paste volume
required per castellation pad is
t, nominal stencil thickness
0.127
0.152
0.203
mm
Allowable Misalignment Tolerance
X - Direction
Theta - Direction
l
w, the width of aperture is fixed at 0.7 mm (0.028 inches)
SOLDER PASTE
METAL STENCIL
inches
If the printed solder paste volume
is adequate, the HSDL-2100
will self align after solder
reflow. Units should be properly
0.36 cubic mm
either on-clean or aqueous solder
cream types with typically 60 to
65% solid content by volume).
0.005
0.006
0.008
See Figure 4.0
APERTURE AS PER
LAND DIMENSIONS
15% (based on
< = 0.2 mm (0.008 inches)
w
3.8
3.4
2.7
mm
0.1
0.1
0.1
t (STENCIL THICKNESS)
3 degrees
l, length of aperture
15
reflowed in IR-Hot Air convection
oven using the recommended
reflow profile. The direction of
board travel does not matter.
2.1. Recommended Metal
Solder Stencil Aperture.
To ensure adequate printed
solder paste volume, the
following combination of metal
stencil aperture and metal stencil
thickness should be used:
0.150
0.134
0.106
inches
0.004
0.004
0.004