hsdl-2100 ETC-unknow, hsdl-2100 Datasheet - Page 2

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hsdl-2100

Manufacturer Part Number
hsdl-2100
Description
Compliant Transceiver
Manufacturer
ETC-unknow
Datasheet

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A brief description of the 2 basic
sub-assemblies, Optical
SubAssembly (OSA) and
Electrical SubAssembly (ESA), is
on page 2.
Applications Information
The Applications Engineering
group, in the Hewlett-Packard
Communications Semiconductor
Solutions Division, is available
to assist you with the technical
understanding associated with
this IR transceiver module. You
can contact them through your
local Hewlett-Packard sales
representative for additional
details.
Optical SubAssembly
The Optical SubAssemblies (OSA)
includes a Transmitter and a
Receiver. The transmitter has
I/O Pins Configuration Table
Pin
10
1
2
3
4
5
6
7
8
9
Receiver Data Output – Channel B
Receiver Data Output – Channel A
Transmitter Data Input
Threshold Capacitor
Averaging Capacitor
Ground (Analog)
PIN Bypass Cap
Supply Voltage
Description
LED Anode
Ground
a discrete emitter that utilizes
a high speed, high efficiency,
Transparent Substrate, double
heterojunction, Aluminum
Gallium Arsenide (TS AlGaAs)
LED technology with an integral
lens in a clear molded package.
The transmitter lens is optimized
for speed, efficiency, and
distance at an emission wavelength
of 870 nm.
The receiver utilizes a discrete
silicon PIN photodiode with an
integral lens in a molded package
and contains a dye to absorb
visible light. The receiver lens
magnifies the effective area of the
PIN diode to enhance sensitivity.
The power supply for the PIN
and preamplifier are filtered to
attenuate noise from external
sources.
Symbol
RXD-B
RXD-A
LEDA
GND
GND
TXD
CX3
CX4
CX1
V
CC
2
Electrical SubAssembly
The Electrical SubAssembly
(ESA) consists of a printed circuit
board on which a bipolar silicon
Integrated Circuit (IC) and
various surface-mount passive
circuit elements are attached. The
IC contains an LED driver and a
receiver providing two output
signals, RXD-A and RXD-B.

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