ia3222 integration, ia3222 Datasheet - Page 27

• Manufacturer Part Number: ia3222
• Description: Ia3222/ia3223 Ez Daa? Chipset With Analog Interface
• Manufacturer: integration

Sample Layout
Layout Guidelines
• Minimize trace lengths between U1, R1 and R15.
• Disc capacitors and their connecting traces should be drawn exactly as shown, with 4.95mm (195 mils) diameters, 2.5mm (98.5
• Carefully observe the required creepage distance (surface distance over isolation) for surge rating. There must be at least 2.5mm
• Put no metal markings in the area of the disk capacitors. This must be watched closely, since PCB manufacturers routinely add
• For optimal audio performance, minimize trace lengths between the System Side and its supply-decoupling capacitors.
• Q2, Q3 and Q4 should be laid out with a lot of extra copper on both sides of the board with thermal vias in order to facilitate heat
mils) spacing and 10-mil traces in between on the system side only. All dimensions must match. This assumes a standard board
thickness (0.062”) and FR-4 material. Contact IAI for other board thicknesses or materials.
(98.5 mils) between any line-side conductive trace and any system-side conductive trace, including the mounting holes if the are
electrically connected. Because of PCB manufacturing tolerances, the minimum drawn distances should be about 2% larger, or
2.55mm (100.5 mils). It is a good practice to designate a “preferred arc path” between the Tip and Ring lines and the chassis, e.g.
at the RJ-11 connector, by drawing those at the minimum required distance, while all other spacings between Line Side and
System Side are drawn lightly larger, e.g. 2.8mm (110 mils).
markings wherever they find it convenient, possibly shortening the creepage distance.
dissipation.
Figure 26: IA3222/3223 evaluation board layout
IA3222/IA3223
27