m36w0r5020b0 STMicroelectronics, m36w0r5020b0 Datasheet - Page 24

• Manufacturer Part Number: m36w0r5020b0
• Description: 32 Mbit 2mb X16, Multiple Bank, Burst Flash Memory And 4 Mbit Sram, 1.8v Supply Multi-chip Package
• Manufacturer: STMicroelectronics

M36W0R5020T0, M36W0R5020B0
PART NUMBERING
Table 13. Ordering Information Scheme
Example:
M36 W0 R 5 0 2 0 T 0 ZAQ T
Device Type
M36 = Multi-Chip Package (Flash + RAM)
Flash 1 Architecture
W = Multiple Bank, Burst mode
Flash 2 Architecture
0 = none present
Operating Voltage
R = V
= V
=V
= 1.7 to 1.95V
DDF
DDQ
DDP
Flash 1 Density
5 = 32 Mbit
Flash 2 Density
0 = none present
RAM 1 Density
2 = 4 Mbit
RAM 0 Density
0 = none present
Parameter Blocks Location
T = Top Boot Block Flash
B = Bottom Boot Block Flash
Product Version
0 = 0.13µm Flash technology, 70ns; 0.15µm RAM, 70ns speed
Package
ZAQ = Stacked TFBGA88 8 x 10mm - 8x10 active ball array, 0.8mm pitch
Option
Blank = Standard Packing
T = Tape & Reel Packing
E = Lead-free and RoHS Package, Standard Packing
F = Lead-free and RoHS Package, Tape & Reel Packing
Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available op-
tions (Speed, Package, etc.) or for further information on any aspect of this device, please contact the ST-
Microelectronics Sales Office nearest to you.
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